請左右滑動表格
| Process
Items |
Control / Inspection Items |
Method/Criteria |
Sample Frequency |
Responsibility | Records |
|---|---|---|---|---|---|
|
Wafer Fabrication |
WAT Oxide Defect Poly Defect Contact Defect Glass Defect Metal Defect Wafer Thickness |
2 Acc. & 3 Rej. per 1 test item 2 Acc. & 3 Rej. per wafer 2 Acc. & 3 Rej. per wafer 2 Acc. & 3 Rej. per wafer 2 Acc. & 3 Rej. per wafer 2 Acc. & 3 Rej. per wafer 0 Acc. & 1 Rej. per wafer |
Each wafer lot | Foundry QRA |
Foundry Wafer OQC report ‧WAT ‧Final summary report ‧Wafer inspection report |
| CP test | CP Yield | Yield > 95% (typical) per wafer | Each wafer lot | Supplier QRA/ Product |
CP testing report Monthly CP Yield Summary Incoming record |
| Assembly | Assembly Yield | Assembly yield > 98% (typical) | Each product lot | Supplier QRA |
Assembly Weekly Report |
| Final Test | FT Yield | Open/short yield loss < 0.5% (typical) FT yield > 95% (typical) |
Each product lot | Supplier QRA/Product |
FT Yield Report Monthly FT Yield Summary Incoming Record |