請左右滑動表格
| Process Items | Control / Inspection Items | Method/Criteria | Sample Frequency | Responsibility | Records |
|---|---|---|---|---|---|
Wafer Fabrication | WAT Oxide Defect Poly Defect Contact Defect Glass Defect Metal Defect Wafer Thickness | 2 Acc. & 3 Rej. per 1 test item 2 Acc. & 3 Rej. per wafer 2 Acc. & 3 Rej. per wafer 2 Acc. & 3 Rej. per wafer 2 Acc. & 3 Rej. per wafer 2 Acc. & 3 Rej. per wafer 0 Acc. & 1 Rej. per wafer | Each wafer lot | Foundry QRA | Foundry Wafer OQC report ‧WAT ‧Final summary report ‧Wafer inspection report |
| CP test | CP Yield | Yield > 90% (typical) per wafer | Each wafer lot | Supplier QRA/ Product | CP testing report Monthly CP Yield Summary Incoming record |
| Assembly | Assembly Yield | Assembly yield > 99% (typical) | Each product lot | Supplier QRA | Assembly Weekly Report |
| Final Test | FT Yield | Open/short yield loss < 0.5% (typical) FT yield > 90% (typical) | Each product lot | Supplier QRA/Product | FT Yield Report Monthly FT Yield Summary Incoming Record |