1. Package Reliability :
Pre-Condition ( for SMD package ):
‧TCT 10cycle+Back 125C/24hr+Soak 30C/60%/192hr+IR flow 3cycle/260C
‧ TCT ( temperature cycle):-65C(15min)~150C(15min),200cycle
‧ TST ( thermal shock):-65C(5min)~150C(5min),100cycle
‧ PCT ( pressure cooker):121C/100%/2atm/96hr
‧ THT ( temperature / humidity ):85C/85%/168hr,500hr
2. Life Test Reliability :
‧HOLT( high temperature operation life test ):85C or 125C/Vcc
‧Apply/168hr,500hr,1000hr
‧HSLT(high temperature static life test ):150C/500hr,1000hr
3. ESD ( HBM, MM)
‧Latch- Up |