|
|
|
|
|
|
| Wafer Fabrication |
WAT
Oxide Defect
Poly Defect
Contact Defect
Glass Defect
Metal Defect
Wafer Thickness |
2 Acc. & 3 Rej. per 1 test item
2 Acc. & 3 Rej. per wafer
2 Acc. & 3 Rej. per wafer
2 Acc. & 3 Rej. per wafer
2 Acc. & 3 Rej. per wafer
2 Acc. & 3 Rej. per wafer
0 Acc. & 1 Rej. per wafer |
Each wafer lot |
Foundry
QRA |
Foundry Wafer OQC report
‧WAT
‧Final
summary report
‧Wafer inspection report |
| CP test |
CP Yield
INK |
Yield > 85% (typical) per wafer
Open/short yield loss < 3% (typical) |
Each wafer lot |
Supplier
QRA/ Product |
CP testing report
Monthly CP Yield Summary
Incoming record |
| Assembly |
Assembly Yield |
Assembly yield > 99% (typical) |
Each week |
Supplier
QRA |
Assembly Weekly Report |
| Final Test |
FT Yield |
Open/short yield loss < 3% (typical)
FT yield > 90% (typical) |
each product lot |
Supplier
QRA/Product |
FT Yield Report
Monthly FT Yield Summary
Incoming Record |
| Tape & Reel |
Tape Reel yield |
Tape Reel yield > 99% |
Each Product Lot |
Supplier
QRA |
Tape Reel yield report
Tape Reel report |
