Product Control Plan


Process

Items


Control /

Inspection Items

Method/Criteria

Sample

Frequency

Responsibility

Records

Wafer

Fabrication

WAT

Oxide Defect

Poly Defect

Contact Defect

Glass Defect

Metal Defect

Wafer Thickness

2 Acc. & 3 Rej. per 1 test item

2 Acc. & 3 Rej. per wafer

2 Acc. & 3 Rej. per wafer

2 Acc. & 3 Rej. per wafer

2 Acc. & 3 Rej. per wafer

2 Acc. & 3 Rej. per wafer

0 Acc. & 1 Rej. per wafer

Each wafer lot

Foundry

QRA

Foundry Wafer OQC report

‧WAT

‧Final summary report

‧Wafer inspection report

CP test

CP Yield

Yield > 90% (typical) per wafer

Each wafer lot

Supplier

QRA/ Product

CP testing report

Monthly CP Yield Summary

Incoming record

Assembly

Assembly Yield

Assembly yield > 99% (typical)

Each product lot

Supplier

QRA

Assembly Weekly Report

Final Test

FT Yield

Open/short yield loss < 0.5% (typical)

FT yield > 90% (typical)

Each product lot

Supplier

QRA/Product

FT Yield Report

Monthly FT Yield Summary

Incoming Record